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Showing results 92961 to 92980 of 277491
| FLIGHT DYNAMICS OF FLAPPING-WING MICRO AIR VEHICLES: AN INTEGRATIVE ANALYSIS OF NONLINEAR FLIGHT DYNAMICS AND UNSTEADY AERODYNAMICS Han, Jae Hung, ASME-JSME-KSME Joint Fluids Engineering Conference 2015, KSME, 2015-07-26 |
| Flight Goggles 시뮬레이터의 모델 분석 및 움직이는 가상의 목표를 이용한 자율 비행 위인환; 이응창; 김태연; 심현철, 한국항공우주학회 2019년도 춘계학술대회, 한국항공우주학회, 2019-04-18 |
| Flight Path Angle Control of Small Scale Rotary Unmanned Aerial Vehicle Kannan, Somasundar; Lian, B.H.; Bang, Hyochoong, KSAS-JSASS Joint Symposium on Aerospace Engineering, pp.150 - 153, KSAS, JSASS, 2004-11-18 |
| Flight Technical Error Evaluations for GBAS Navigation Requirement Definition Felux, Michael; Lee, Jiyun; Holzapfel, Florian, 31st Congress of the International Council of the Aeronautical Sciences, ICAS 2018, International Council of the Aeronautical Sciences, 2018-09 |
| Flight test environment using magnetic levitation for flight characteristics identification of MAV Sung, Yeol-Hun; Lee, Dong-Kyu; Kim, Ho-Young; Han, Jae-Hung, 29th International Conference on Adaptive Structures and Technologies (ICAST 2018), ICAST, 2018-10-01 |
| Flight testing of a university based H2O2/HDPE hybrid sounding rocket at KAIST Huh, Jeongmoo; Kim, Youngil; Yun, Yongtae; Ahn, Byeonguk; Kwon, Sejin; Lee, Jaewan; Yoon, Hosung, 53rd AIAA/SAE/ASEE Joint Propulsion Conference, 2017, American Institute of Aeronautics and Astronautics Inc, AIAA, 2017-07 |
| Flight testing of an University based H2O2/HDPE Hybrid Sounding Rocket at KAIST Huh, Jeongmoo; Kim, Youngil; Yun, Yongtae; Ahn, Byeonguk; Kwon, Sejin, 2017 Propulsion and energy (53rd JPC), The American Institute of Aeronautics and Astronautics, 2017-07-11 |
| Flight testing of technology demonstrator with hydrogen peroxide hybrid rocket Yun, Yongtae; Seo, Joungki; Park, Kiyun; Jeong, Junyeong; Kim, Juwon; Kwon, Sejin, AIAA Propulsion and Energy Forum and Exposition, 2019, American Institute of Aeronautics and Astronautics Inc, AIAA, 2019-08-21 |
| Flight Tests of the Vision-based Target Sensing and Approaching Cho, Sungwook; Jeong, Yeun Duk; Shim, David Hyunchul, the 30th Congress of the International Council of the Aeronautical Sciences, pp.1 - 7, International Council of the Aeronautical Sciences, 2016-09-26 |
| FlightGoggles 시뮬레이터를 이용한 Drone의 Visual-Inertial 상태 추정(VINS-Mono)에 관한 분석 이응창; 위인환; 김태연; 문상근; 심현철, 한국항공우주학회 2019년도 춘계학술대회, 한국항공우주학회, 2019-04-18 |
| Flip Chip Assembly on Board using Anisotropic Conductive Adhesive/Film and Nickel-Gold Bump Paik, Kyung-Wook, Advances in Electronic Packaging, pp.367 - 372, 1999-06-01 |
| Flip Chip Assembly on Board using Anisotropic Conductive Film and Electroless Ni/Au Bumps 백경욱, 한국재료학회 추계학술대회, pp.81 - 81, 한국재료학회, 1998-11-01 |
| Flip chip assembly on organic boards using anisotropic conductive adhesives (ACAs) and nickel/gold bumps Yim, MJ; Jeon,YD; Paik, Kyung-Wook, 2000 Electronics Packaging Technology Conference(3rd EPTC), pp.378 - 384, EPTC, 2000-12-01 |
| Flip chip assembly on organic boards using anisotropic conductive adhesives/films and nickel/gold bump Yim, MJ; Jeon, YD; Paik, Kyung-Wook, InterPACK '99: Pacific RIM/ASME International Intersociety Electronics Photonic Packaging Conference 'Advances in Electronic Packaging 1999', v.26, 1999-06-13 |
| Flip chip assembly on PCB substrates with coined solder bumps Nah, JW; Paik, Kyung-Wook; Cho, SJ; Kim, WH, 53rd Electronic Components and Technology Conference, pp.244 - 249, IEEE, 2003-05-27 |
| Flip Chip Assembly Using Anisotropic Conductive Adhesives with Enhanced Thermal Conductivity 임명진; 김형준; 백경욱, 마이크로전자 및 패키징학회지, v.12, no.1, pp.9 - 16, 2005-03 |
| Flip chip interconnection using anisotropic conductive adhesives for RF and high frequency applications Yim, MJ; Jung, IH; Choi, HK; Kim, K; Hwang, JS; Ahn, JY; Kwon, W; et al, 53rd Electronic Components and Technology Conference 2003, pp.1398 - 1403, IEEE, 2003-05-27 |
| Flip chip interconnection with anisotropic conductive adhesives for RF and high-frequency applications Yim, MJ; Jeong, IH; Choi, HK; Hwang, JS; Ahn, JY; Kwon, W; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.28, pp.789 - 796, 2005-12 |
| Flip Chip on Organic Board Technology using Modified Anisotropic Conductive Films and Electroless Nickel/Gold Bump 백경욱; 임명진; 전영두, 한국마이크로전자 및 패키징학회지, v.6, no.2, pp.13 - 21, 1999-06 |
| Flip Chip 접속을 위한 무전해 니켈 범프의 형성 및 특성 연구 전영두; 임명진; 백경욱, 한국재료학회지, v.9, no.11, pp.1095 - 1101, 1999-11 |
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