Flip Chip Assembly on Board using Anisotropic Conductive Film and Electroless Ni/Au Bumps

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Publisher
한국재료학회
Issue Date
1998-11-01
Language
KOR
Citation

한국재료학회 추계학술대회, pp.81 - 81

URI
http://hdl.handle.net/10203/117891
Appears in Collection
MS-Conference Papers(학술회의논문)
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