Flip Chip 접속을 위한 무전해 니켈 범프의 형성 및 특성 연구Fabrication and Characteristics of Electroless Ni Bump for Flip Chip Interconnection

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Publisher
한국재료학회
Issue Date
1999-11
Language
Korean
Citation

한국재료학회지, v.9, no.11, pp.1095 - 1101

ISSN
1225-0562
URI
http://hdl.handle.net/10203/69768
Appears in Collection
MS-Journal Papers(저널논문)
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