Prediction of three-dimensional solder joint profile in gullwing leads

Publisher
International Microelectronics And Packaging Society
Issue Date
1998
Language
ENG
Citation

INTERNATIONAL JOURNAL OF MICROCIRCUITS AND ELECTRONIC PACKAGING, v.21, no.2, pp.162 - 170

ISSN
1063-1674
URI
http://hdl.handle.net/10203/73406
Appears in Collection
ME-Journal Papers(저널논문)
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