Prediction of three-dimensional solder joint profile in gullwing leads
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Yoo, Choong-Don | ko |
| dc.contributor.author | Choi, Tong P. | ko |
| dc.contributor.author | Lee, Tae S. | ko |
| dc.date.accessioned | 2013-02-28T07:03:34Z | - |
| dc.date.available | 2013-02-28T07:03:34Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1998 | - |
| dc.identifier.citation | INTERNATIONAL JOURNAL OF MICROCIRCUITS AND ELECTRONIC PACKAGING, v.21, no.2, pp.162 - 170 | - |
| dc.identifier.issn | 1063-1674 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/73406 | - |
| dc.language | English | - |
| dc.publisher | International Microelectronics And Packaging Society | - |
| dc.title | Prediction of three-dimensional solder joint profile in gullwing leads | - |
| dc.type | Article | - |
| dc.type.rims | ART | - |
| dc.citation.volume | 21 | - |
| dc.citation.issue | 2 | - |
| dc.citation.beginningpage | 162 | - |
| dc.citation.endingpage | 170 | - |
| dc.citation.publicationname | INTERNATIONAL JOURNAL OF MICROCIRCUITS AND ELECTRONIC PACKAGING | - |
| dc.contributor.localauthor | Yoo, Choong-Don | - |
| dc.contributor.nonIdAuthor | Choi, Tong P. | - |
| dc.contributor.nonIdAuthor | Lee, Tae S. | - |
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