BGA 패키지의 열피로 특성에 관한 연구 = A study on thermal fatigue behavior of BGA package

Advisors
이순복researcherLee, Soon-Bokresearcher
Publisher
한국과학기술원
Issue Date
2004
Identifier
237892/325007  / 020023132
Language
kor
Description

학위논문(석사) - 한국과학기술원 : 기계공학전공, 2004.2, [ vii, 70 p. ]

Keywords

열피로; 전자패키지; 비납소더; lead-free solder; thermal fatigue; BGA

URI
http://hdl.handle.net/10203/45983
Link
http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=237892&flag=t
Appears in Collection
ME-Theses_Master(석사논문)
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