DC Field | Value | Language |
---|---|---|
dc.contributor.advisor | 이순복 | - |
dc.contributor.advisor | Lee, Soon-Bok | - |
dc.contributor.author | 김일호 | - |
dc.contributor.author | Kim, Il-Ho | - |
dc.date.accessioned | 2011-12-14T06:49:21Z | - |
dc.date.available | 2011-12-14T06:49:21Z | - |
dc.date.issued | 2004 | - |
dc.identifier.uri | http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=237892&flag=dissertation | - |
dc.identifier.uri | http://hdl.handle.net/10203/45983 | - |
dc.description | 학위논문(석사) - 한국과학기술원 : 기계공학전공, 2004.2, [ vii, 70 p. ] | - |
dc.language | kor | - |
dc.publisher | 한국과학기술원 | - |
dc.subject | 열피로 | - |
dc.subject | 전자패키지 | - |
dc.subject | 비납소더 | - |
dc.subject | lead-free solder | - |
dc.subject | thermal fatigue | - |
dc.subject | BGA | - |
dc.title | BGA 패키지의 열피로 특성에 관한 연구 | - |
dc.title.alternative | A study on thermal fatigue behavior of BGA package | - |
dc.type | Thesis(Master) | - |
dc.identifier.CNRN | 237892/325007 | - |
dc.description.department | 한국과학기술원 : 기계공학전공, | - |
dc.identifier.uid | 020023132 | - |
dc.contributor.localauthor | 김일호 | - |
dc.contributor.localauthor | Kim, Il-Ho | - |
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