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Showing results 621 to 629 of 629

621	Over GHz electrical circuit model of a high-density multiple line grid array (MLGA) interposer Ahn, Seungyoung; Lee, Junho; Kim, Joungho; Ryu, Woonghwan; Kum, Byung-Hun; Choi, HS; Yoon, CK, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.26, pp.90 - 98, 2003-02
622	High-frequency SPICE model of anisotropic conductive film flip-chip interconnections based on a genetic algorithm Ryu, Woonghwan; Yim, Myung-Jin; Ahn, Seungyoung; Lee, Junho; Kim, Woopoung; Paik, Kyung-Wook; Kim, Joungho, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.23, no.3, pp.542 - 545, 2000-09
623	RF interconnect for multi-Gbit/s board-level clock distribution Ryu, Woonghwan; Lee, Junwoo; Kim, Hyungsoo; Ahn, Seungyoung; Kim, Namhoon; Choi, Baekkyu; Kam, Donggun; et al, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.23, no.3, pp.398 - 407, 2000-08
624	Effect of anisotropic propagation modeling on microcellular system design Har, Dongsoo; Bertoni, HL, IEEE TRANSACTIONS ON VEHICULAR TECHNOLOGY, v.49, no.4, pp.1303 - 1313, 2000-07
625	Propagation modelling for wireless local loop channel Har, Dongsoo; Xu, C; Xia, HH, INTERNATIONAL JOURNAL OF COMMUNICATION SYSTEMS, v.13, no.3, pp.231 - 241, 2000-05
626	Microwave model of anisotropic conductive film flip-chip interconnections for high frequency applications Yim, MJ; Ryu, W; Jeon, YD; Lee, J; Ahn, Seungyoung; Kim, Joungho; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.22, no.4, pp.575 - 581, 1999-12
627	Path-loss prediction model for microcells Har, Dongsoo; Xia, HH; Bertoni, HL, IEEE TRANSACTIONS ON VEHICULAR TECHNOLOGY, v.48, no.5, pp.1453 - 1462, 1999-09
628	Comment on diffraction loss of rooftop-to-street in COST 231-Walfisch-Ikegami model Har, Dongsoo; Watson, AM; Chadney, AG, IEEE TRANSACTIONS ON VEHICULAR TECHNOLOGY, v.48, no.5, pp.1451 - 1452, 1999-09
629	비접촉 자기 유도 충전 방식을 갖는 전기자동차의 집전제어 방법 조동호; 서인수; 이흥열; 이준호; 양학진; 윤대훈; 박영규; et al

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