High-frequency SPICE model of anisotropic conductive film flip-chip interconnections based on a genetic algorithm

Cited 14 time in webofscience Cited 0 time in scopus
  • Hit : 485
  • Download : 1139
This paper firstly reports on the high-frequency SPICE model of the ACF flip-chip interconnections up to 13 GHz. The extraction process Is based on an optimization procedure, called a genetic algorithm, which is known as a robust optimization tool. The proposed equivalent circuit model of the ACF interconnection can readily be used in SPICE circuit simulations for signal integrity analysis of high-frequency packages. Two different ACF interconnections were studied using the Au-coated polymer ball and Ni-filled ball. The extracted models of the two ACFs were found strongly dependent on not only size and rigidity of the conducting balls, but also on their magnetic permeability.
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Issue Date
2000-09
Language
English
Article Type
Article
Citation

IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.23, no.3, pp.542 - 545

ISSN
1521-3331
URI
http://hdl.handle.net/10203/18484
Appears in Collection
GT-Journal Papers(저널논문)MS-Journal Papers(저널논문)EE-Journal Papers(저널논문)
Files in This Item
This item is cited by other documents in WoS
⊙ Detail Information in WoSⓡ Click to see webofscience_button
⊙ Cited 14 items in WoS Click to see citing articles in records_button

qr_code

  • mendeley

    citeulike


rss_1.0 rss_2.0 atom_1.0