DSpace at KOASAS
College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Experimental analysis on the mechanism of moisture induced interface weakening in ACF package

Cited 0 time in webofscience Cited 0 time in scopus
  • Hit : 360
  • Download : 635
Export
Sim, Gidongresearcher / Chung, CK / Paik, KW / Lee, Soon-Bokresearcher
Publisher
European Microelectronics and Packaging Conference, EMPC 2009
Issue Date
2009-06-15
Language
English
Citation

European Microelectronics and Packaging Conference, EMPC 2009

URI
http://hdl.handle.net/10203/24739
Appears in Collection
ME-Conference Papers(학술회의논문)
Files in This Item

Display Full Item Record

qr_code

  • mendeley

    citeulike

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.


rss_1.0 rss_2.0 atom_1.0