Browse "School of Electrical Engineering(전기및전자공학부)" by Title
Showing results 36681 to 36700 of 50978
| Theory of Electric Enthalpy of Formation in Electrified Interfaces Lee, Ryong Gyu; Kim, Yong-Hoon; Lee, Juho; Yeo, Hyeonwoo, International Workshop on Computational Nanotechnology, IWCN 2023, Institute for Microelectronics, 2023-06-12 |
| THEORY OF ELECTRIC FIELD-INDUCED OPTICAL MODULATION IN SINGLE AND MULTIQUANTUM WELL STRUCTURES USING A MONTE-CARLO APPROACH SINGH, J; Hong, Songcheol, IEEE JOURNAL OF QUANTUM ELECTRONICS, v.22, no.10, pp.2017 - 2021, 1986-10 |
| THEORY OF MARKOVIAN ACCESS TO COLLISION CHANNELS Lim, Jong-Tae; MEERKOV, SM, IEEE TRANSACTIONS ON COMMUNICATIONS, v.35, no.12, pp.1278 - 1288, 1987-12 |
| Thermal Analysis of DDR5 DIMM with Forced Air Cooling Method Son, Keeyoung; Kim, Joungho; Lho, Daehwan; Kim, SeongGuk; Park, Joonsang; Kim, Keunwoo; Choi, Namhyeon; et al, IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2022, IEEE, 2022-12-13 |
| Thermal and chemical stability of reflowed-photoresist microlenses Han, MG; Park, YJ; Kim, SH; Yoo, BS; Park, HyoHoon, JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.14, no.3, pp.398 - 402, 2004-03 |
| Thermal and Signal Integrity Co-Design and Verification of Embedded Cooling Structure With Thermal Transmission Line for High Bandwidth Memory Module Son, Keeyoung; Kim, Seongguk; Park, Hyunwook; Shin, Taein; Kim, Keunwoo; Kim, Minsu; Sim, Boogyo; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.12, no.9, pp.1542 - 1556, 2022-09 |
| Thermal annealing chracteristics of amorphous silicon-based solar cells incorporating stable protocrystalline silicon and unstable microcrystalline silicon at the onset of a microcrystalline regime Ahn, J.Y.; Jun, K.H.; Konagai, M.; Lim, Koeng Su, Proceddings of the 3rd World Conference on Photovoltaic Energy Conversion, pp.1741 - 1744, 2003-05-11 |
| Thermal Annealing 효과에 의한 다층박막 FBAR 소자의 공진특성개선 윤기완; 김동현; 임문혁; Linh, Mai, 한국해양정보통신학회추계학술대회, pp.633 - 636, 한국해양정보통신학회, 2003-10 |
| Thermal Characterics of Long-Period Grating in Silicon Optical Waveguide Cho, YB; Yang, BK; Shin, Sang Yung, Asia-Pacific Optical Communications, 2006 |
| Thermal characteristics of InGaP/GaAs HBT ballasted with extended ledge Jeon, S; Park, HM; Hong, Songcheol, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.48, no.10, pp.2442 - 2445, 2001-10 |
| Thermal characteristics of long-period gratings in silicon optical waveguide Cho, Y.B.; Yang, B.K.; Shin, Sang Yung, Passive Components and Fiber-based Devices III, v.6351 I, 2006-09-05 |
| Thermal Conductivity and Thermal Boundary Resistances of ALD Al2O3 Films on Si and Sapphire Lee, Seung-Min; Choi, Won Chul; Kim, Junsoo; Kim, Taekwang; Lee, Jaewoo; Im, Sol Yee; Kwon, Jung Yoon; et al, INTERNATIONAL JOURNAL OF THERMOPHYSICS, v.38, no.176, 2017-12 |
| Thermal conductivity measurement of silicon/silicide laminated structures by 3w method Choi, Won Cheol; Kim, Jun Soo; Kim, Soo Jeong; Kim, Tae Kwang; Jung, Heun Dal; Jung, Tae Hyung; Nam, Eun Soo; et al, 2015 European Materials Research Society (EMRS) Spring Meeting, EMRS, 2015-05-14 |
| Thermal conductivity of ultrathin Si films with a periodic pore pattern Oh, Jung Hyun; Choi, Won Chul; Jang, Moon Kyu; Shin, Mincheol, 17th International Workshop on Computational Electronics, IWCE 2014, 2014-06-06 |
| Thermal diffusion barrier metallization based on Co-Mo powder-mixed composites for n-type skutterudite ((Mm,Sm)(y)Co4Sb12) thermoelectric devices Song, Jinseop; Kim, Yeongseon; Cho, Byung Jin; Yoo, Chung-Yul; Yoon, Hana; Park, Sang Hyun, JOURNAL OF ALLOYS AND COMPOUNDS, v.818, 2020-03 |
Thermal display glove for interacting with virtual reality Kim, Seung-Won; Kim, Sung Hee; Kim, Choong Sun; Yi, Kyoungsoo; Kim, Jun-Sik; Cho, Byung Jin; Cha, Youngsu, SCIENTIFIC REPORTS, v.10, no.1, 2020-07 |
| Thermal effect analysis on crosstalk and performance of optoelectronic transmitter modules for optical interconnects Ukaegbu, Ikechi Augustine; Uddin, M. Rakib; Sangirov, Jamshid; Nguyen, Nga T. H.; Lee, Tae-Woo; Cho, Mu Hee; Park, Hyo-Hoon, OPTICAL AND QUANTUM ELECTRONICS, v.49, no.8, 2017-08 |
| Thermal effects on interconnect crosstalk of optoelectronic transmitter modules Ukaegbu, Ikechi Augustine; Sangirov, Jamshid; Nakarmi, Bikash; Lee, Tae Woo; Cho, Mu Hee; Park, HyoHoon, SPIE/COS Photonics Asia 2012, The International Society for Optical Engineering, Chinese Optical Society, 2012-11-07 |
| Thermal Effects on Through-Silicon-Via (TSV) Signal Integrity Lee, Manho; Cho, Jonghyun; Pak, Jun So; Lee, Hyungdong; Kim, Joungho, 62nd Electronic Components and Technology Conference (ECTC), 62nd Electronic Components and Technology Conference (ECTC), 2012-05-29 |
| Thermal hardware-based data security device that permanently erases data by using local heat generation phenomenon and method thereof Choi, Yang-Kyu; Park, Jun-Young |
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