Browse "School of Electrical Engineering(전기및전자공학부)" by Title
Showing results 25901 to 25920 of 51623
| Modeling and analysis of Buck-type three phase PWM rectifier by circuit DQ transformation Han, Soo-Bin; Choi, Nam-Sup; Rim, Chuntaek; Cho, Gyu-Hyeong, Power Electronics Specialists Conference, 1995. PESC '95 Record., 26th Annual IEEE, pp.431 - 436, IEEE, 1995-06 |
| Modeling and Analysis of CDMA Soft Handoff Sung, Dan Keun; Park, S; Cho, HS, IEEE Vehicular Technology Conference, pp.1525 - 1529, 1996 |
| Modeling and analysis of chip-package-pcb hierarchical power distribution network based on segmentation method = 구조 분할 방법에 기반한 칩-패키지-보드 계층적 전력분배망의 모델링 및 분석link Kim, Jae-Min; 김재민; et al, 한국과학기술원, 2010 |
| Modeling and analysis of combined mobility management based on implicit cell update scheme in general packet radio service Chung, Y.W.; Sung, Dan Keun, 57th IEEE Semiannual Vehicular Technology Conference (VTC2003), v.57, no.1, pp.160 - 164, 2003-04-22 |
| Modeling and analysis of coupling between TSVs, metal, and RDL interconnects in TSV-based 3D IC with silicon interposer Yoon, K.; Kim, G.; Lee, W.; Song, T.; Lee, J.; Lee, H.; Park, K.; et al, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.702 - 706, 2009-12-09 |
| Modeling and Analysis of Defects in Through Silicon Via Channel for Non-invasive Fault Isolation Kim, Joungho; Kim, Heegon; Kim, Jonghoon J; Kim, Sukjin; Bae, Hyun-Cheol; Choi, Kwang-Seong, IEEE International 3D Systems Integration Conference (3DIC), IEEE International 3D Systems Integration Conference (3DIC), 2015-08-31 |
| Modeling and analysis of Die-to-Die vertical coupling and RF sensitivity degradation in 3-D IC = 집적화된 3차원 IC에서의 층간 수직 커플링 현상 분석 및 모델링과 RF 신호 민감성 저하에 대한 연구link Lee, Sang-Rok; 이상록; et al, 한국과학기술원, 2010 |
| Modeling and analysis of die-to-die vertical coupling in 3-D IC Lee, S.; Kim, G.; Kim, J.; Song, T.; Lee, J.; Lee, H.; Park, K.; et al, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.707 - 711, 2009-12-09 |
| Modeling and analysis of differential signal Through Silicon Via (TSV) in 3D IC Kim, J.; Pak, J.S.; Cho, J.; Lee, J.; Lee, H.; Park, K.; Kim, Joungho, 2010 IEEE CPMT Symposium Japan, ICSJ10, IEEE, 2010-08-24 |
| Modeling and analysis of eye-diagram distortion and data-dependent jitter in meander delay lines on high-speed pcbs based on time-domain multi-mode crosstalk analysis = 고속 인쇄회로 기판에 사용되는 미앤더 지연 회로에서 시간영역 멀티모드 크로스톡 분석 기반의 아이다이어그램 왜곡과 데이터 의존성 지터에 대한 해석 및 모델링link Kim, Ga-Won; 김가원; et al, 한국과학기술원, 2010 |
| Modeling and analysis of ground integrity (GI) in power distribution network (PDN) of mobile systems and high bandwidth memory (HBM) = 모바일 시스템 및 고대역폭 메모리의 전력망에서 접지 무결성 모델링 및 분석link Park, Shinyoung; Kim, Joungho; et al, 한국과학기술원, 2021 |
| Modeling and Analysis of High-Speed Through Silicon Via (TSV) Channel and Defects Jung, Daniel H; Kim, Joungho; Kim, Jonghoon J; Kim, Heegon; Choi, Sumin; Lim, Jaemin; Bae, Hyun-Cheol; et al, 2016 IEEE International Conference on Signal and Power Integrity (SIPI 2016), pp.430 - 433, 2016 IEEE International Conference on Signal and Power Integrity (SIPI 2016), 2016-07-27 |
| Modeling and analysis of LC-VCO performance degradation and shielding for tsv noise coupling in 3D IC = 3차원 집적회로에서 실리콘 관통 비아의 잡음전달과 LC-VCO 성능 저하의 모델링 및 분석과 차폐에 대한 연구link Lim, Jae-Min; 임재민; et al, 한국과학기술원, 2014 |
| Modeling and analysis of millimeter/sub-millimeter wave indoor communications for multi-gigabit wireless transmission Choi, Yonghoon; Han, Youngnam, 39th International Conference on Infrared, Millimeter and Terahertz Waves, IRMMW-THz 2014, IEEE Computer Society, 2014-09 |
| Modeling and Analysis of Mis-Rounting Calls in Universal Personal Telecommunication Services in Fixed Networks Sung, Dan Keun; Chung, YW; Kwon, SJ, IEICE APCC 2001, pp.264 - 267, 2001-09 |
| Modeling and Analysis of Mobile Terminal Power ON/OFF-State Management Considering User Behavior Chung, Yun Won; Chun, Min Young; Sung, Dan Keun, IEEE TRANSACTIONS ON VEHICULAR TECHNOLOGY, v.57, no.6, pp.3708 - 3722, 2008-11 |
| Modeling and analysis of mobility management state of packet-switched (PS) services in GPRS Chung, Yun Won; Hwang, Ho Young; Sung, Dan Keun, COMPUTER COMMUNICATIONS, v.30, no.1, pp.166 - 177, 2006-12 |
| Modeling and analysis of multiple coupled through-silicon vias (TSVs) for 2.5-D/3-D ICs Cho, Kyungjun; Kim, Youngwoo; Park, Junyong; Kim, Hyesoo; Kim, Seongguk; Kim, Subin; Park, Gap Yeol; et al, Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility, EMC Sapporo/APEMC 2019, pp.346 - 349, Institute of Electrical and Electronics Engineers Inc., 2019-06 |
| Modeling and analysis of noise coupling and RF sensitivity in through-silicon-via (TSV) silicon interposer = 실리콘 관통 비아 실리콘 인터포져에서의 노이즈 커플링 모델링과 RF감도 해석link Yoon, Ki-Hyun; 윤기현; et al, 한국과학기술원, 2010 |
| Modeling and Analysis of Open Defect in Through Silicon Via (TSV) Channel Kim, Joungho; Jung, Daniel H; Kim, Heegon; Kim, Jonghoon J; Bae, Hyun-Cheol; Choi, Kwangseong, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), pp.163 - 166, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), 2013-12-15 |
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