Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Type Conference
Showing results 6201 to 6220 of 7308
| Thermal spin-orbit torque induced by spin Nernst effect in W/CoFeB/MgO structures Kim, jeongmok; Kim, Dongjun; Park, Byong-Guk, 14th Joint MMM-Intermag Conference, IEEE Magnetic Society, 2019-01-16 |
| Thermal stability at the anisotropic conductive films (ACFs) / organic solderability preservatives (OSPs) interface Kim, I; Kim, HJ; Paik, Kyung-Wook, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, pp.0, 123, 2007-11-19 |
| Thermal stability of (Sr1-x,Bax)3MgSi 2O8:Eu2+ phosphor for plasma display panel applications Im, WB; Kim, YI; Jeon, Duk Young, 44th International Symposium, Seminar, and Exhibition, SID 2006, pp.554 - 557, 2006-06-04 |
| Thermal Stability of RuO2 and thin films in the Various ambients Kim, Ho Gi, IUMRS-ICEM, pp.131 - 131, 1998-01-01 |
| Thermal stability study of Eu2+-doped BaAl2Si 2O8 phosphor using polymorphism for plasma display panel applications Im, WB; Kim, YI; Jeon, Duk Young, 5th International Meeting on Information Display, pp.1568 - 1571, Korean Information Display Society, 2005-07-19 |
| Thermal Stability Study of Eu2+-doped BaAl2Si2O8 Phosphor using its Polymorphism for Plasma Display Panel applications Jeon, Duk Young; Im, WB; Kim, YI, 2005 GIST/KAIST/Kyoto/Tohoku university joint symposium, pp.32 -, 2005 |
| Thermal Stable Flexible Vertical μLED Patch for Hair Growth Treatment Kim, Min Seo; LEE, JAEHEE; Lee, Keon Jae, The 23rd International Meeting on Information Display, The Korean Information Display Society, 2023-08-24 |
| Thermal-Wave Imaging of Ceramic/Metal Boundaries and of Voids in Low and High Thermal Conductivity Ceramics No, Kwangsoo; McClelland, John F, Review of Progress in Quantative Nondestructive Evaluation, pp.263 - 272, 1988 |
| Thermally Resistant Robust Metal Nanowire-embedded Glass-fabric Reinforced Hybrimer Films for Transparent Conductive Films Bae, Byeong-Soo; Im, Hyeon-Gyun; Lee, Jaemin; Jung, Su-Ho; Kim, Hwea-Yoon; Lee, Jung-Yong; Kim, Il-Doo, 2013 International Meeting on Information Display, IMID, 2013-08 |
| Thermally Robust 3D Metal Oxide Nano-architecture Containing Various Catalyst Components for Ultra-selective Gas Sensor Han, Hyeuk Jin; Jung, Yeon Sik; Lee, Gyu Rac, International Conference on Electronic Materials and Nanotechnology for Green Environment (ENGE 2018), The Korean Institute of Metals and Materials, 2018-11-12 |
| Thermally Soldered Au Nanogrids with Enhanced Plasmon Quality for Quantitative Multiplexing of Trace-Amount Molecules via SERS Cho, Seung Hee; Jung, Yeon Sik, 2019 MRS Spring Meeting and Exhibit, Materials Research Society, 2019-04-23 |
| Thermally Stable Photo-Curable Cyclo-aliphatic Epoxy hybrid Material for White LED Encapsulant 배병수; SeungCheol Yang; Seung-Yeon Kwak; Joon-Soo Kim, 2011년도 추계 고분자학회, 한국고분자학회, 2011-10 |
| Thermally stable Sol-Gel derived siloxane hydrid material for light emitting diode (LED) encapsulation Bae, Byeong-Soo; Bae, Junyoung; Kim, Yongho; Kim, Hwea-yoon, 2013 International Sol-Gel Conference, ISGS, 2013-08 |
| Thermally stable transparent sol-gel siloxane hybrid materials for LED encapsulants Bae, Byeong-Soo; Kim, J; Yang, S, The International Chemical Congress of Pacific Basin Societies, PACIFICHEM 2010, 2010-12 |
| Thermally Stable Vertical μLED Patch for Facilitating Hair Growth LEE, JAEHEE; Lee, Keon Jae, 2022 MRS SPRING MEETING & EXHIBIT, Materials Research Society, 2022-05-11 |
| Thermally Stable Vertical μLED Patch for Facilitating Hair Growth by Light Stimulation Lee, JaeHee; Lee, Keon Jae, The 22nd International Meeting on Information Display (IMID 2022), The Korean Information Display Society, 2022-08-26 |
| Thermo-Calc를 이용한 슈퍼 듀플렉스 스테인리스강의 상평형 계산 박상희; 박중근, 대한금속재료학회, 추계학술발표대회, v.38, 대한금속재료학회, 2000 |
| Thermo-compression bonding using Non-Conductive Films (NCFs) for 3-D TSV Micro-bump Interconnection Lee. Hyeong Gi; Lee, Se Yong; Choi, Yong Won; Paik, Kyung Wook, IEEE 66th Electronic Components and Technology Conference, pp.1809 - 1815, IEEE 66th Electronic Components and Technology Conference, 2016-06-01 |
| Thermo-Mechanical Reliability of the Benzocyclobutane(BCB) film in a WLCSP Process Yu, Jin; Lee, KO; Kim, JY; Park, IS, Proc.3rd Electronic Materials and Packaging, pp.84 - 87, 2001 |
| Thermo-Mechanical Stress Analysis of Lamination Based MCM-D Substrate 백경욱, 제6회 한국반도체 학술대회, pp.269 - 272, 한국반도체 학술대회, 1999-02-01 |
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