DSpace at KOASAS: Thermo-Mechanical Stress Analysis of Lamination Based MCM-D Substrate

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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Thermo-Mechanical Stress Analysis of Lamination Based MCM-D Substrate

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Publisher: 한국반도체 학술대회

Issue Date: 1999-02-01

Language: KOR

Citation: 제6회 한국반도체 학술대회, pp.269 - 272

URI: http://hdl.handle.net/10203/138015

Appears in Collection: MS-Conference Papers(학술회의논문)

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