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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Thermo-Mechanical Reliability of the Benzocyclobutane(BCB) film in a WLCSP Process

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Yu, Jinresearcher / Lee, KO / Kim, JY / Park, IS
Issue Date
2001
Language
ENG
Citation

Proc.3rd Electronic Materials and Packaging, pp.84 - 87

URI
http://hdl.handle.net/10203/134959
Appears in Collection
MS-Conference Papers(학술회의논문)
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