Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Subject BI
Showing results 1 to 15 of 15
| A FORMATION MECHANISM OF BI-2223 BY MIXING INTERMEDIATE COMPOUNDS IN THE BI(PB)-SR-CA-CU-O SYSTEM KWON, SC; LEE, HG; Ahn, Byung Tae; Nam, Soo Woo, SUPERCONDUCTOR SCIENCE TECHNOLOGY, v.8, no.7, pp.552 - 557, 1995-07 |
| Compact swelling in Bi1.4B0.6Sr2Ca2Cu3.6Oy During The Formation Of High-Tc Superconducting Phase Kim, CJ; Kang, Suk-Joong L; Won, DY, JOURNAL OF THE AMERICAN CERAMIC SOCIETY, v.75, no.3, pp.570 - 574, 1992-03 |
| Creep deformation of lead-free Sn-3.5Ag-Bi solders Shin, SW; Yu, Jin, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, v.42, no.3, pp.1368 - 1374, 2003-03 |
| Creep deformation of Sn-3.5Ag-xCu and Sn-3.5Ag-xBi solder joints Shin, SW; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.34, no.2, pp.188 - 195, 2005-02 |
| Demonstration and characterization of Sn-3.0Ag-0.5Cu/Sn-57Bi-1Ag combination solder for 3-D multistack packaging Jo, Yun-Hwan; Lee, Joo-Won; Seo, Sun-Kyoung; Lee, Hyuck-Mo; Han, Hun; Lee, Dong-Chun, JOURNAL OF ELECTRONIC MATERIALS, v.37, no.1, pp.110 - 117, 2008-01 |
| Effect of in addition on Sn-3.5Ag solder and joint with Cu substrate Choi, WK; Yoon, SW; Lee, HyuckMo, MATERIALS TRANSACTIONS, v.42, no.5, pp.783 - 789, 2001 |
| Effects of interfacial states on electrical properties of SrBi2Ta2O9 thin films Choi, GP; Park, JH; Lee, CH; Kim, Il-Doo; Kim, Ho Gi, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.39, no.9A, pp.5151 - 5155, 2000-09 |
| Effects of pad metallization on the low cycle fatigue characteristics of Sn-based solder joints Lee, K. O.; Yu, Jin; Park, T. S.; Lee, Soon-Bok, INTERNATIONAL JOURNAL OF FATIGUE, v.48, pp.1 - 8, 2013-03 |
| Interfacial microstructure and joint strength of Sn-3.5Ag-X (X = Cu, In, Ni) solder joint Choi, WK; Kim, JH; Jeong, SW; Lee, HyuckMo, JOURNAL OF MATERIALS RESEARCH, v.17, no.1, pp.43 - 51, 2002-01 |
| Interfacial reaction between 42Sn-58Bi solder and electroless Ni-P/immersion Au under bump metallurgy during aging Cho, MG; Paik, Kyung-Wook; Lee, HyuckMo; Booh, SW; Kim, TG, JOURNAL OF ELECTRONIC MATERIALS, v.35, no.1, pp.35 - 40, 2006-01 |
| Low-cycle fatigue characteristics of Sn-based solder joints Lee, KO; Yu, Jin; Park, TS; Lee, Soon-Bok, JOURNAL OF ELECTRONIC MATERIALS, v.33, no.4, pp.249 - 257, 2004-04 |
| Preparation of Superconducting Bi(Pb)-Sr-Ca-Cu-O Thick-Films on Magnesia Substrate Kim, DH; Um, WS; No, Kwangsoo; Kim, Ho Gi, JOURNAL OF THE AMERICAN CERAMIC SOCIETY, v.74, no.9, pp.2102 - 2106, 1991-09 |
| The Effects of The Sintering Schedule on The Superconducting Properties of Bi(Pb)-Sr-Ca-Cu-O Thick-Films Kim, DH; Um, WS; No, Kwangsoo; Kim, Ho Gi, SUPERCONDUCTOR SCIENCE TECHNOLOGY, v.5, no.3, pp.145 - 150, 1992-03 |
| Time dependence of electrical properties of SrBi2Ta2O9 thin films after top electrode annealing Choi, GP; Park, JH; Lee, CH; Kim, Il-Doo; Kim, Ho Gi, MATERIALS LETTERS, v.45, no.3-4, pp.208 - 212, 2000-09 |
| 무연 솔더와 무전해 니켈-인 하부금속 층간의 계면 반응과 솔더 조인트에 미치는 비스무스 합금의 영향 = Effects of Bi on interfacial reaction and bump strength in electroless Ni-P UBM/ Pb-free solder bumpslink 조문기; Cho, Moon-Gi; et al, 한국과학기술원, 2004 |
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