Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Subject TECHNOLOGY
Showing results 23 to 43 of 43
| Magnetophoretic position detection for multiplexed immunoassay using colored microspheres in a microchannel Hahn, Young-Ki; Chang, Jae-Byum; Jin, Zong-Wen; Kim, Hak-Sung; Park, Je-Kyun, BIOSENSORS & BIOELECTRONICS, v.24, no.7, pp.1870 - 1876, 2009-03 |
| Measurement and Analysis for Residual Warpage of Chip-on-Flex (COF) and Chip-in-Flex (CIF) Packages Jang, Jae-Won; Suk, Kyoung-Lim; Paik, Kyung-Wook; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.5, pp.834 - 840, 2012-05 |
| Micro Light-Emitting Diodes for Display and Flexible Biomedical Applications Lee, Haneol; Shin, Jung Ho; Park, Jung Hwan; Hong, Seong Kwang; Park, Sanghyun; Lee, Seung Hyung; Lee, Jae Hee; et al, ADVANCED FUNCTIONAL MATERIALS, v.29, no.24, 2019-06 |
| Multiwavelength Raman characterization of silicon stress near through-silicon vias and its inline monitoring applications Yoo, Woo Sik; Kim, Jae Hyun; Han, Seung Min J., JOURNAL OF MICRO-NANOLITHOGRAPHY MEMS AND MOEMS, v.13, no.1, 2014-02 |
| Nanoscale bit formation in highly (111)-oriented ferroelectric thin films deposited on glass substrates for high-density storage media Kim, Dae Hong; Kim, Yong Kwan; Hong, Daniel Seungbum; Kim, Yunseok; Baik, Sunggi, NANOTECHNOLOGY, v.22, no.24, 2011-05 |
| Non-conductive film with Zn-nanoparticles (Zn-NCF) for 40 mu m pitch Cu-pillar/Sn-Ag bump interconnection Shin, Ji Won; Kim, Il; Choi, Yong-Won; Kim, Youngsoon; Kang, Un Byung; Jee, Young Kun; Paik, Kyung-Wook, MICROELECTRONICS RELIABILITY, v.55, no.2, pp.432 - 441, 2015-02 |
| Parallel Fabrication of Electrode Arrays on Single-Walled Carbon Nanotubes using Dip-Pen-Nanolithography-Patterned Etch Masks Park, Steve; Wang, Wechung Maria; Bao, Zhenan, LANGMUIR, v.26, no.9, pp.6853 - 6859, 2010-05 |
| Protein micropatterning on bifunctional organic-inorganic sol-gel hybrid materials Kim, Woo-Soo; Kim, Min-Gon; Ahn, Jun-Hyeong; Bae, Byeong-Soo; Park, Chan Beum, LANGMUIR, v.23, no.9, pp.4732 - 4736, 2007-04 |
| Residual stress and interfacial reaction of the electroplated Ni-Cu alloy under bump metallurgy in the flip-chip solder joint Kim, SH; Kim, JY; Yu, Jin; Lee, TY, JOURNAL OF ELECTRONIC MATERIALS, v.33, no.9, pp.948 - 957, 2004-09 |
| Self-Assembly of Metalloporphyrins into Light-Harvesting Peptide Nanofi ber Hydrogels for Solar Water Oxidation Kim, Jae Hong; Nam, Dong Heon; Lee, Yang Woo; Nam, Yoon Sung; Park, Chan Beum, SMALL, v.10, no.7, pp.1272 - 1277, 2014-04 |
| Silicon epitaxial growth on poly-Si film by HWCVD for low-temperature poly-Si TFTs Lee, Seung Ryul; Ahn, Kyung Min; Ahn, Byung Tae, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.154, no.9, pp.778 - 781, 2007 |
| Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni-P metallization Sohn, YC; Yu, Jin; Kang, SK; Shih, DY; Lee, TY, JOURNAL OF MATERIALS RESEARCH, v.19, no.8, pp.2428 - 2436, 2004-08 |
| Study of the reaction mechanism between electroless Ni-P and Sn and its effect on the crystallization of Ni-P Sohn, YC; Yu, Jin; Kang, SK; Choi, WK; Shih, DY, JOURNAL OF MATERIALS RESEARCH, v.18, no.1, pp.4 - 7, 2003-01 |
| Study on the Mechanism and Modeling for Super-filling of High-Aspect-Ratio Features with Copper by Catalyst Enhanced Chemical Vapor Deposition Coupled with Plasma Treatment Kim, Chang-Gyu; Lee, Do-Seon; Lee, Won-Jong, KOREAN JOURNAL OF METALS AND MATERIALS, v.49, no.4, pp.334 - 341, 2011-04 |
| Surface morphology improvement of metalorganic chemical vapor deposition Al films by layered deposition of Al and ultrathin TiN Ahn, Seong-Deok; Lee, Hyun-Bae; Kang, Sang-Won, JAPANESE JOURNAL OF APPLIED PHYSICS, v.39, no.6A, pp.3349 - 3354, 2000-06 |
| Synthesis of multi-walled carbon nanotube/silver nanocomposite powders by chemical reduction in aqueous solution Daoush, Walid M.; Hong, Soon-Hyung, JOURNAL OF EXPERIMENTAL NANOSCIENCE, v.8, no.5, pp.578 - 587, 2013-07 |
| THE EFFECT OF GLASS FRITS ON THE MICROSTRUCTURE AND ELECTRICAL-PROPERTIES OF BISMUTH RUTHENATE THICK-FILM RESISTORS NAM, SH; Kim, Ho Gi, THIN SOLID FILMS, v.195, no.1-2, pp.43 - 51, 1991-01 |
| The effect of plasma treatment on adsorbed iodine as a catalyst in chemical vapor deposition of copper and application to filling of deep trenches with high aspect ratios Lee, Do-Seon; Lee, Won-Jong, JAPANESE JOURNAL OF APPLIED PHYSICS, v.48, no.7, pp.076004-1 - 076004-6, 2009-07 |
| Transfer Printing by Kinetic Control of Adhesion to an Elastomeric Stamp Meitl, Mattew A; Zhu, Zheng-Tao; Kumar, Vipan; Lee, Keonjae; Feng, Xue; Huang, Yonggang Y; Adesida, Ilesanmi; et al, NATURE MATERIALS, v.5, no.1, pp.33 - 38, 2006-01 |
| Transparent, thermally stable methyl siloxane hybrid materials using sol-gel synthesized vinyl-methyl oligosiloxane resin Bae, Jun-Young; Jang, Junho; Bae, Byeong-Soo, JOURNAL OF SOL-GEL SCIENCE AND TECHNOLOGY, v.82, no.1, pp.253 - 260, 2017-04 |
| Zinc and Tin-Zinc Via-Filling for the Formation of Through-Silicon Vias in a System-in-Package Jee, YK; Park, KW; Oh, TS; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.38, no.5, pp.685 - 690, 2009-05 |
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