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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Reliability evaluation for flip-chip electronic packages under high temperature and moisture condition using moire

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Park, JH / Jang, KW / Paik, KW / Lee, Soon-Bokresearcher
Publisher
123
Issue Date
2008-12-09
Language
English
Citation

10th Electronics Packaging Technology Conference, EPTC 2008, pp.633 - 638

URI
http://hdl.handle.net/10203/157640
Appears in Collection
ME-Conference Papers(학술회의논문)
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