높은 미끄럼 비의 점 접촉 EHL 하에서 발생하는 딤플 영역의 온도 분포와 유막 두께 분포의 측정Measurements of Film Thickness and Temperature Distribution in Dimple Zone Developed in EHL Point Contact at High Slip Ratios

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In this paper, film thickness and temperature distribution are measured in EHL point contact at high slip ratios. Infrared temperature mapping with two band pass fillers. proposed by Ausherman (1976). is used to measure temperature distribution. And the optical interferornetric method with two filters (red and green filters) is used to measure film thickness. Result of experiment showed that temperature rising at film and ball surface occurred very dramatically in Dimple zone. As slip velocity, slip ratio and load increased, size of Dimple and temperature rising became more large In addition, Position and shape of Dimple we changed by slip ratios, and increasing of Dimple size decreased traction coefficient. In short, it is appointed that the Dimple phenomenon be developed by the effect of viscosity wedge.
Publisher
대한기계학회
Issue Date
2003-04
Language
Korean
Citation

대한기계학회논문집 A, v.27, no.4, pp.479 - 484

ISSN
1226-4873
URI
http://hdl.handle.net/10203/15487
Appears in Collection
ME-Journal Papers(저널논문)
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