높은 미끄럼 비의 점 접촉 EHL 하에서 발생하는 딤플 영역의 온도 분포와 유막 두께 분포의 측정

Abstract

In this paper, film thickness and temperature distribution are measured in EHL point contact at high slip ratios. Infrared temperature mapping with two band pass fillers. proposed by Ausherman (1976). is used to measure temperature distribution. And the optical interferornetric method with two filters (red and green filters) is used to measure film thickness. Result of experiment showed that temperature rising at film and ball surface occurred very dramatically in Dimple zone. As slip velocity, slip ratio and load increased, size of Dimple and temperature rising became more large In addition, Position and shape of Dimple we changed by slip ratios, and increasing of Dimple size decreased traction coefficient. In short, it is appointed that the Dimple phenomenon be developed by the effect of viscosity wedge.