High Reliable Non-Conductive Adhesives for Flip Chip CSP Applications

Publisher
2002 Electronic Components & Technology Conference
Issue Date
2002-05-28
Language
ENG
Citation

2002 Electronic Components & Technology Conference , pp.1385 - 1389

URI
http://hdl.handle.net/10203/1413
Appears in Collection
MS-Conference Papers(학술회의논문)
Files in This Item
FC_72.pdf(1.4 MB)Download
  • Hit : 684
  • Download : 1151
  • Cited 0 times in thomson ci

qr_code

  • mendeley

    citeulike


rss_1.0 rss_2.0 atom_1.0