High Reliable Non-Conductive Adhesives for Flip Chip CSP Applications
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Yim, MJ | - |
| dc.contributor.author | Hwang, JS | - |
| dc.contributor.author | Kwon, WS | - |
| dc.contributor.author | Jang, KW | - |
| dc.contributor.author | Paik, Kyung-Wook | - |
| dc.date.accessioned | 2007-09-11T06:15:34Z | - |
| dc.date.available | 2007-09-11T06:15:34Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2002-05-28 | - |
| dc.identifier.citation | 2002 Electronic Components & Technology Conference , v., no., pp.1385 - 1389 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/1413 | - |
| dc.language | ENG | - |
| dc.language.iso | en_US | en |
| dc.publisher | 2002 Electronic Components & Technology Conference | - |
| dc.title | High Reliable Non-Conductive Adhesives for Flip Chip CSP Applications | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 1385 | - |
| dc.citation.endingpage | 1389 | - |
| dc.citation.publicationname | 2002 Electronic Components & Technology Conference | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
| dc.contributor.nonIdAuthor | Yim, MJ | - |
| dc.contributor.nonIdAuthor | Hwang, JS | - |
| dc.contributor.nonIdAuthor | Kwon, WS | - |
| dc.contributor.nonIdAuthor | Jang, KW | - |
- Appears in Collection
- MS-Conference Papers(학술회의논문)
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