Studies on Ni-Sn intermetallic compound and P-rich Ni layer at the electroless Nickel UBM - Solder interface and their effects on flip chip solder joint reliability

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Publisher
IEEE
Issue Date
2001-05-29
Language
ENG
Citation

51st Electronic Components and Technology Conference, pp.1326 - 1332

ISSN
0569-5503
URI
http://hdl.handle.net/10203/1395
Appears in Collection
MS-Conference Papers(학술회의논문)
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