DSpace at KOASAS
College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Studies on Ni-Sn intermetallic compound and P-rich Ni layer at the electroless Nickel UBM - Solder interface and their effects on flip chip solder joint reliability

Cited 0 time in webofscience Cited 0 time in scopus
  • Hit : 934
  • Download : 5939
Export
DC FieldValueLanguage
dc.contributor.authorJeon, YD-
dc.contributor.authorPaik, Kyung-Wook-
dc.contributor.authorBok, KS-
dc.contributor.authorChoi, WS-
dc.contributor.authorCho, CL-
dc.date.accessioned2007-09-11T05:17:46Z-
dc.date.available2007-09-11T05:17:46Z-
dc.date.created2012-02-06-
dc.date.issued2001-05-29-
dc.identifier.citation51st Electronic Components and Technology Conference, v., no., pp.1326 - 1332-
dc.identifier.issn0569-5503-
dc.identifier.urihttp://hdl.handle.net/10203/1395-
dc.description.sponsorshipThe authors would like to acknowledge financial support provided by the Samsung Techwin Co.,Ltd., KOREA.en
dc.languageENG-
dc.language.isoen_USen
dc.publisherIEEE-
dc.titleStudies on Ni-Sn intermetallic compound and P-rich Ni layer at the electroless Nickel UBM - Solder interface and their effects on flip chip solder joint reliability-
dc.typeConference-
dc.identifier.scopusid2-s2.0-0034821493-
dc.type.rimsCONF-
dc.citation.beginningpage1326-
dc.citation.endingpage1332-
dc.citation.publicationname51st Electronic Components and Technology Conference-
dc.identifier.conferencecountryUnited States-
dc.identifier.conferencecountryUnited States-
dc.contributor.localauthorPaik, Kyung-Wook-
dc.contributor.nonIdAuthorJeon, YD-
dc.contributor.nonIdAuthorBok, KS-
dc.contributor.nonIdAuthorChoi, WS-
dc.contributor.nonIdAuthorCho, CL-
Appears in Collection
MS-Conference Papers(학술회의논문)
Files in This Item
FC_52.pdf(1.15 MB)Download

Display Simple Item Record

qr_code

  • mendeley

    citeulike

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.


rss_1.0 rss_2.0 atom_1.0