Isothermal low cycle fatigue tests of Sn/3.5 Ag/0.75 Cu and 63Sn/37Pb solder joints under mixed-mode loading cases

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Issue Date
2002-05-28
Language
ENG
Citation

52nd Electronic Components and Technology Conference, pp.979 - 984

ISSN
0569-5503
URI
http://hdl.handle.net/10203/128921
Appears in Collection
ME-Conference Papers(학술회의논문)
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