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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Measurement of Thermal Deformations of Chip Scale Packages Using Moire Interferometry

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Ham, SJ / Hwang, TK / Lee, Soon-Bokresearcher
Issue Date
2001
Language
KOR
Citation

SEMICON Korea Technical Symposium 2001, Serial 14, pp.239 - 244

URI
http://hdl.handle.net/10203/126265
Appears in Collection
ME-Conference Papers(학술회의논문)
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