Internal stresses evolution of non conductive pastes (NCPs) and underfill materials for flip chip applications

Publisher
IEEE
Issue Date
2005-05-31
Language
ENG
Citation

55th Electronic Components and Technology Conference, ECTC, v.2, pp.1486 - 1490

ISSN
0569-5503
URI
http://hdl.handle.net/10203/1237
Appears in Collection
MS-Conference Papers(학술회의논문)
Files in This Item
FC_101.pdf(684.71 kB)Download
  • Hit : 447
  • Download : 326
  • Cited 0 times in thomson ci

qr_code

  • mendeley

    citeulike


rss_1.0 rss_2.0 atom_1.0