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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Internal stresses evolution of non conductive pastes (NCPs) and underfill materials for flip chip applications

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dc.contributor.authorJang, KWko
dc.contributor.authorKim, HJko
dc.contributor.authorKwon, WSko
dc.contributor.authorPaik, Kyung-Wookko
dc.date.accessioned2007-09-03T06:40:03Z-
dc.date.available2007-09-03T06:40:03Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2005-05-31-
dc.identifier.citation55th Electronic Components and Technology Conference, ECTC, pp.1486 - 1490-
dc.identifier.issn0569-5503-
dc.identifier.urihttp://hdl.handle.net/10203/1237-
dc.languageEnglish-
dc.language.isoen_USen
dc.publisherIEEE-
dc.titleInternal stresses evolution of non conductive pastes (NCPs) and underfill materials for flip chip applications-
dc.typeConference-
dc.identifier.wosid000230581600231-
dc.identifier.scopusid2-s2.0-24644504236-
dc.type.rimsCONF-
dc.citation.beginningpage1486-
dc.citation.endingpage1490-
dc.citation.publicationname55th Electronic Components and Technology Conference, ECTC-
dc.identifier.conferencecountryUS-
dc.identifier.conferencelocationLake Buena Vista, FL-
dc.embargo.liftdate9999-12-31-
dc.embargo.terms9999-12-31-
dc.contributor.localauthorPaik, Kyung-Wook-
dc.contributor.nonIdAuthorJang, KW-
dc.contributor.nonIdAuthorKim, HJ-
dc.contributor.nonIdAuthorKwon, WS-
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MS-Conference Papers(학술회의논문)
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