Cu/SnAg double bump flip chip assembly as an alternative of solder flip chip on organic substrates for fine pitch applications

Publisher
IEEE
Issue Date
2007-05-29
Language
ENG
Citation

57th Electronic Components and Technology Conference 2007, ECTC '07, pp.864 - 871

ISSN
0569-5503
URI
http://hdl.handle.net/10203/1230
Appears in Collection
MS-Conference Papers(학술회의논문)
Files in This Item
FC_122.pdf(3.1 MB)Download
  • Hit : 578
  • Download : 986
  • Cited 0 times in thomson ci

qr_code

  • mendeley

    citeulike


rss_1.0 rss_2.0 atom_1.0