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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Cu/SnAg double bump flip chip assembly as an alternative of solder flip chip on organic substrates for fine pitch applications

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dc.contributor.authorSon, HYko
dc.contributor.authorJung, GJko
dc.contributor.authorLee, JKko
dc.contributor.authorChoi, JYko
dc.contributor.authorPaik, Kyung-Wookko
dc.date.accessioned2007-09-03T06:00:18Z-
dc.date.available2007-09-03T06:00:18Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2007-05-29-
dc.identifier.citation57th Electronic Components and Technology Conference 2007, ECTC '07, pp.864 - 871-
dc.identifier.issn0569-5503-
dc.identifier.urihttp://hdl.handle.net/10203/1230-
dc.description.sponsorshipThis work was supported by the Korea Materials & Components Industry Agency (KMAC), Korea Science and Engineering Foundation. We would like to thank to Mr. H. S. Jang and Mr. S. Y. Choi of Sonix Korea for SAM analysis and technical discussion and appreciate KBSI (Korea Basic Science Institute) for SEM and EPMA analysis.en
dc.languageEnglish-
dc.language.isoen_USen
dc.publisherIEEE-
dc.titleCu/SnAg double bump flip chip assembly as an alternative of solder flip chip on organic substrates for fine pitch applications-
dc.typeConference-
dc.identifier.wosid000247705500133-
dc.identifier.scopusid2-s2.0-35348911844-
dc.type.rimsCONF-
dc.citation.beginningpage864-
dc.citation.endingpage871-
dc.citation.publicationname57th Electronic Components and Technology Conference 2007, ECTC '07-
dc.identifier.conferencecountryUS-
dc.identifier.conferencelocationSparks, NV-
dc.embargo.liftdate9999-12-31-
dc.embargo.terms9999-12-31-
dc.contributor.localauthorPaik, Kyung-Wook-
dc.contributor.nonIdAuthorSon, HY-
dc.contributor.nonIdAuthorJung, GJ-
dc.contributor.nonIdAuthorLee, JK-
dc.contributor.nonIdAuthorChoi, JY-
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