DC Field | Value | Language |
---|---|---|
dc.contributor.author | Son, HY | ko |
dc.contributor.author | Jung, GJ | ko |
dc.contributor.author | Lee, JK | ko |
dc.contributor.author | Choi, JY | ko |
dc.contributor.author | Paik, Kyung-Wook | ko |
dc.date.accessioned | 2007-09-03T06:00:18Z | - |
dc.date.available | 2007-09-03T06:00:18Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2007-05-29 | - |
dc.identifier.citation | 57th Electronic Components and Technology Conference 2007, ECTC '07, pp.864 - 871 | - |
dc.identifier.issn | 0569-5503 | - |
dc.identifier.uri | http://hdl.handle.net/10203/1230 | - |
dc.description.sponsorship | This work was supported by the Korea Materials & Components Industry Agency (KMAC), Korea Science and Engineering Foundation. We would like to thank to Mr. H. S. Jang and Mr. S. Y. Choi of Sonix Korea for SAM analysis and technical discussion and appreciate KBSI (Korea Basic Science Institute) for SEM and EPMA analysis. | en |
dc.language | English | - |
dc.language.iso | en_US | en |
dc.publisher | IEEE | - |
dc.title | Cu/SnAg double bump flip chip assembly as an alternative of solder flip chip on organic substrates for fine pitch applications | - |
dc.type | Conference | - |
dc.identifier.wosid | 000247705500133 | - |
dc.identifier.scopusid | 2-s2.0-35348911844 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 864 | - |
dc.citation.endingpage | 871 | - |
dc.citation.publicationname | 57th Electronic Components and Technology Conference 2007, ECTC '07 | - |
dc.identifier.conferencecountry | US | - |
dc.identifier.conferencelocation | Sparks, NV | - |
dc.embargo.liftdate | 9999-12-31 | - |
dc.embargo.terms | 9999-12-31 | - |
dc.contributor.localauthor | Paik, Kyung-Wook | - |
dc.contributor.nonIdAuthor | Son, HY | - |
dc.contributor.nonIdAuthor | Jung, GJ | - |
dc.contributor.nonIdAuthor | Lee, JK | - |
dc.contributor.nonIdAuthor | Choi, JY | - |
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