Showing results 129161 to 129180 of 275872
Microwave Engineering Education at KAIST Ra, Jung Woong, Asia-Pacific Microwave Technology and Educatuon Workshop, 1991 |
Microwave extraction of graphene from carbon fibers Sridhar, V; Jeon, JH; Oh, Il-Kwon, CARBON, v.49, no.1, pp.222 - 226, 2011-01 |
Microwave frequency crosstalk model of redistribution line patterns on wafer level package Sung, M.; Kim, N.; Lee, J.; Kim, H.; Choi, B.K.; Kim, J.-M.; Hong, J.-K.; et al, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.25, no.2, pp.265 - 271, 2002-05 |
Microwave frequency crosstalk model of redistribution line patterns on wafer level package Sung, M.; Kim, N.; Lee, J.; Choi, B.; Park, I.; Hong, J.-K.; Kwon, Y.; et al, IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging, pp.109 - 112, IEEE, 2001-10-29 |
Microwave Frequency Dielectric Constant and Loss Tangent Measurements of PCB materials Using Stripline Structure Kim, Joungho; Kim, Jingook; Lee, Junho; Kim, Namhoon; Lee, Junwoo, APACK2001, 2001 |
Microwave Frequency Generation, Switching, and Controlling Using Single-Mode FP-LDs Nakarmi, Bikash; Chen, Hao; Won, Yong Hyub; Pan, Shilong, JOURNAL OF LIGHTWAVE TECHNOLOGY, v.36, no.19, pp.4273 - 4281, 2018-10 |
Microwave frequency interconnection line model of a wafer level package Lee, J; Ryu, W; Kim, Joungho; Kim, N; Pak, J; Kim, JM, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.25, pp.356 - 364, 2002-08 |
Microwave frequency measurement and modeling of flip chip interconnects = 플립칩 패키지의 마이크로파 주파수 영역에서의 측정 및 모델링에 관한 연구link Kwon, Woon-Seong; 권운성; et al, 한국과학기술원, 2001 |
Microwave Frequency Model of Flip-Chip interconnects using Anisotripic Conductive Film Kim, Joungho, HDP/MCM conference, 1999 |
Microwave frequency model of flip-chip interconnects using anisotropic conductive film Ryu, Woong Hwan; Yim, Myung-Jin; Lee, Junho; Jeon, Young-Doo; Ahn, Seung Young; Yun, Young-Hwan; Ham, Seog-Heon; et al, Proceedings of the 1999 International Conference on High Density Packaging and MCMs, pp.311 - 315, SPIE, 1999-04-06 |
Microwave frequency model of FPBGA solder ball extracted from S-parameters measurement Lee, Jungho; Ahn, Seungyoung; Kwon, Woon-Seong; Paik, Kyung-Wook; Kim, Joungho, IEICE TRANSACTIONS ON ELECTRONICS, v.E87C, pp.1621 - 1627, 2004-09 |
Microwave frequency model of wafer level package based on s-parameter measurement = S-파라미터 측정을 통한 마이크로파 영역에서의 Wafer Level Package 모델에 관한 연구link Lee, Jun-Woo; 이준우; et al, 한국과학기술원, 2001 |
Microwave frequency model of water level package and increased loading effect on rambus memory module Lee, J.; Choi, B.; Ahn, S.; Ryu, W.; Kim, J.M.; Choi, K.S.; Hong, J.-K.; et al, 51st Electronic Components and Technology Conference, pp.128 - 132, 2001-05-29 |
Microwave frequency modeling of next generation high-density packages = 차세대 고밀도 패키지의 마이크로 웨이브 주파수 영역에서의 모델링에 관한 연구link Ahn, Seung-Young; 안승영; et al, 한국과학기술원, 2000 |
Microwave Generation from a Relativistic Anular Beam through a Dielectric Loaded Waveguide 최덕인, 한국물리학회, pp.131 -, 1985 |
Microwave Graphene Syntheses and Graphene-based Artificial Muscles Jeon, Jin-Han; Sridhar, V; Oh, Il-Kwon, 6th World congress on Biomimetics, Articial Muscles and Nano-Bio, Université de Cergy-Pontoise, Université Paris Diderot, 2011-10 |
Microwave Imaging by Using a New Hybrid Algorithm Combined by Simulated Annealing and Gradient Algorithms Ra, Jung Woong, Asia-Pacific Microwave Conference, pp.395 - 398, 1995 |
Microwave Imaging in Angular Spectral Domain Based on the Improved Newton's Procedure C.S.Park; S.K.Park; Ra, Jung Woong, MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, v.7, no.1, pp.28 - 31, 1994-01 |
Microwave Imaging of a Perfectly Conducting Cylinder by Using Modified Newton's Algorithm in the Angular Spectral Domain S.K.Park; C.S.Park; J.W.Ra, 전자공학회논문지, v.31, no.6, pp.34 - 44, 1994-06 |
Microwave Imaging of a Perfectly Conducting Cylinder by Using the Angular Spectrum of the Scattered Fields Ra, Jung Woong, Asia-Pacific Microwave Conference, pp.1205 - 1208, 1994 |
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