Microwave frequency crosstalk model of redistribution line patterns on wafer level package

As the operating frequency of systems increases above the gigahertz frequency range, the electrical performance of a package becomes more critical. Wafer level package (WLP) is a promising solution for future high-speed packaging needs. Because the length of the interconnection lines on the WLP is limited to die size, the WLP has a minimum number of electrical parasitic elements. Because the crosstalk generates significant unwanted noise in nearby lines, causing problems of skew, delay, logic faults, and radiated emission, the crosstalk phenomena is drawing more attention than ever among the electrical characteristics of the WLP. Consequently, the modeling of the crosstalk parameters of the WLP is very important when used in high-speed systems. In this paper, we first report the crosstalk model parameters of the WLP, especially for the redistribution layer. These can be easily embedded into SPICE circuit simulation. The model is represented by the distributed lumped circuit elements, such as the mutual capacitance and the mutual inductance. The crosstalk model was extracted from two-step on-wafer S-parameter measurements and was fitted to the measurements made at up to 5 GHz. The models were obtained as a function of the line spacing between the coupled lines of the WLP. Finally, the extracted crosstalk model was verified by comparing the far-end crosstalk waveform simulated from the extracted model parameters with the far-end crosstalk waveform measured by time domain transmission (TDT) measurement.
Publisher
Institute of Electrical and Electronics Engineers
Issue Date
2002-05
Language
ENG
Citation

IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.25, no.2, pp.265 - 271

ISSN
1521-3323
URI
http://hdl.handle.net/10203/551
Appears in Collection
EE-Journal Papers(저널논문)
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