Bonding Quality of Copper-Nickel Fine Clad Metal Prepared by Surface Activated Bonding

Abstract

The effects of surface roughness and heat treatment on the bonding quality of surface-activated bonding (SAB)-treated copper-nickel fine clad metals were investigated. An increase in the surface roughness of the copper layer decreased the peel strength after cladding, indicating that increases in the surface roughness decreased the contact area between the clad materials in the SAB cladding process, unlike conventional cold rolling that induces high deformation. In addition, the peel strength of the clad metals increased up to 7.3 N/mm with decreasing surface roughness of the copper layer after heat treatment. The change in the total sheet resistance of the copper-nickel clad metal with the heat treatment depended on the balance between a decrease in the sheet resistance due to the reduction of dislocation and the increase in the heat treatment temperature, and an increase in the sheet resistance due to the diffusion of nickel in the copper direction. [doi:10.2320/matertrans.M2009354]