TSV를 이용한 3D패키징 공정 및 장비 기술3D Packaging Process using TSV and Bonding Machine Technology

Cited 0 time in webofscience Cited 0 time in scopus
  • Hit : 371
  • Download : 0
Publisher
한국정밀공학회
Issue Date
2009-12
Language
Korean
Citation

한국정밀공학회지, v.26, no.12, pp.9 - 17

ISSN
1225-9071
URI
http://hdl.handle.net/10203/94113
Appears in Collection
ME-Journal Papers(저널논문)
Files in This Item
There are no files associated with this item.

qr_code

  • mendeley

    citeulike


rss_1.0 rss_2.0 atom_1.0