TSV를 이용한 3D패키징 공정 및 장비 기술3D Packaging Process using TSV and Bonding Machine Technology
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 송준엽 | ko |
| dc.contributor.author | 이재학 | ko |
| dc.contributor.author | 하태호 | ko |
| dc.contributor.author | 이창우 | ko |
| dc.contributor.author | 유중돈 | ko |
| dc.date.accessioned | 2013-03-08T19:54:58Z | - |
| dc.date.available | 2013-03-08T19:54:58Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2009-12 | - |
| dc.identifier.citation | 한국정밀공학회지, v.26, no.12, pp.9 - 17 | - |
| dc.identifier.issn | 1225-9071 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/94113 | - |
| dc.language | Korean | - |
| dc.publisher | 한국정밀공학회 | - |
| dc.title | TSV를 이용한 3D패키징 공정 및 장비 기술 | - |
| dc.title.alternative | 3D Packaging Process using TSV and Bonding Machine Technology | - |
| dc.type | Article | - |
| dc.type.rims | ART | - |
| dc.citation.volume | 26 | - |
| dc.citation.issue | 12 | - |
| dc.citation.beginningpage | 9 | - |
| dc.citation.endingpage | 17 | - |
| dc.citation.publicationname | 한국정밀공학회지 | - |
| dc.identifier.kciid | ART001390951 | - |
| dc.contributor.localauthor | 유중돈 | - |
| dc.contributor.nonIdAuthor | 송준엽 | - |
| dc.contributor.nonIdAuthor | 이재학 | - |
| dc.contributor.nonIdAuthor | 하태호 | - |
| dc.contributor.nonIdAuthor | 이창우 | - |
| dc.subject.keywordAuthor | TSV (실리콘 관통 비아) | - |
| dc.subject.keywordAuthor | Thin Wafer Handling (박형 실리콘 핸들링) | - |
| dc.subject.keywordAuthor | 3D Stacking (3차원 적층) | - |
| dc.subject.keywordAuthor | Self-alignment (자가정렬) | - |
| dc.subject.keywordAuthor | Direct Oxide Bonding (실리콘 옥사이드 본딩) | - |
| dc.subject.keywordAuthor | Low Temperature Bonding (저온접합) | - |
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