A corrosion couple experiment reproducing the black pad phenomenon found after the electroless nickel immersion gold process

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dc.contributor.authorKim, K. H.ko
dc.contributor.authorYu, Jinko
dc.contributor.authorKim, J. H.ko
dc.date.accessioned2013-03-08T15:03:36Z-
dc.date.available2013-03-08T15:03:36Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2010-09-
dc.identifier.citationSCRIPTA MATERIALIA, v.63, no.5, pp.508 - 511-
dc.identifier.issn1359-6462-
dc.identifier.urihttp://hdl.handle.net/10203/93345-
dc.description.abstractThe "black pad" phenomenon, which rarely occurs in electrolessly plated nickel phosphorous (Ni-P) films, was reproduced This work reports that nodular variation of the P content induces potential differences large enough to drive galvanic corrosion when the film is exposed to an electrolyte containing gold cyanide. Subsequent corrosion couple experiments using films with different P contents demonstrated that preferential corrosion occurred at the low P side, and the propensity of forming black pad increased with the difference in P content (Delta P) (C) 2010 Acta Materialia Inc Published by Elsevier Ltd All rights reserved-
dc.languageEnglish-
dc.publisherPERGAMON-ELSEVIER SCIENCE LTD-
dc.subjectPCB FINAL FINISHES-
dc.subjectSOLDER JOINTS-
dc.titleA corrosion couple experiment reproducing the black pad phenomenon found after the electroless nickel immersion gold process-
dc.typeArticle-
dc.identifier.wosid000280048400013-
dc.identifier.scopusid2-s2.0-77953684802-
dc.type.rimsART-
dc.citation.volume63-
dc.citation.issue5-
dc.citation.beginningpage508-
dc.citation.endingpage511-
dc.citation.publicationnameSCRIPTA MATERIALIA-
dc.identifier.doi10.1016/j.scriptamat.2010.05.015-
dc.contributor.localauthorYu, Jin-
dc.contributor.nonIdAuthorKim, K. H.-
dc.type.journalArticleArticle-
dc.subject.keywordAuthorCorrosion-
dc.subject.keywordAuthorGalvanization-
dc.subject.keywordAuthorInterface defects-
dc.subject.keywordAuthorBlack pad-
dc.subject.keywordPlusPCB FINAL FINISHES-
dc.subject.keywordPlusSOLDER JOINTS-
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