Microstructural evolution of polycrystalline Si films during Ni-silicide-mediated lateral crystallization

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Microstructural evolution of polycrystalline Si films during Ni-silicide-mediated lateral crystallization of amorphous Si films has been studied. The growth direction of the crystallized needle-like grains was not parallel to the crystallization direction of the film. The grains were aligned nearly parallel to each other and consequently, a macroscopic quasi grain was formed. The dominant growth directions of the needle-like grains with respect to the crystallization direction were +/-(35 +/- 5)degrees and +/-(55 +/- 5)degrees, which were well matched for the growth of {110}-oriented, needle-like grains along the <111> directions with 70degrees branching and 110degrees branching, respectively. The length of the transition region in front of the silicide-mediated lateral crystallization was about 5 mum; thin-film transistors should not be located here because of poor microstructure. (C) 2004 The Electrochemical Society.
Publisher
ELECTROCHEMICAL SOC INC
Issue Date
2004
Language
English
Article Type
Article
Keywords

AMORPHOUS-SILICON; THIN-FILMS; ELECTRIC-FIELD; TRANSISTORS; TEMPERATURE; TFTS

Citation

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.151, no.6, pp.141 - 144

ISSN
0013-4651
DOI
10.1149/1.1738675
URI
http://hdl.handle.net/10203/9180
Appears in Collection
MS-Journal Papers(저널논문)
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