A study on dielectric constants of epoxy/SrTiO3 composite for embedded capacitor films (ECFs)

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dc.contributor.authorLee, Sangyongko
dc.contributor.authorHyun, Jin-Gulko
dc.contributor.authorKim, Hyungsooko
dc.contributor.authorPaik, Kyung-Wookko
dc.date.accessioned2013-03-07T20:13:13Z-
dc.date.available2013-03-07T20:13:13Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2007-08-
dc.identifier.citationIEEE TRANSACTIONS ON ADVANCED PACKAGING, v.30, no.3, pp.428 - 433-
dc.identifier.issn1521-3323-
dc.identifier.urihttp://hdl.handle.net/10203/91192-
dc.description.abstractEpoxy/BaTiO3 composites have been of great interest as embedded capacitor materials, mainly due to high dielectric constant of ceramic powders, and good process compatibility of epoxy with printed circuit boards (PCBs). However, one of the potential problems of epoxy/BaTiO3 composite is the dielectric relaxation at gigahertz range. In this paper, epoxy/SrT'O-3 composite embedded capacitor films (ECFs) were fabricated for high-frequency applications. Dielectric constants of epoxy/SrTiO3 composite embedded capacitor films with various SrTiO3 particles loading for three different commercial SrTiO3 powders were measured, and experimental data were fitted to the Lichtenecker equation for the prediction of the effective dielectric constant of SrTiO3 powders in epoxy/SrTiO3 composite ECFs. Using a rectangular cavity resonator method, dielectric constants of epoxy/SrTiO3 composite ECFs were measured at gigahertz range (1-10 GHz). At gigahertz frequencies, dielectric constants of epoxy/SrTiO3 composite ECFs were nearly constant. In contrast, epoxy/BaTiO3 composite ECFs showed decrease of dielectric constants above 5 GHz. Therefore, it is concluded that epoxy/SrTiO3 composite ECFs can be more effectively to be applied for high-frequency applications.-
dc.languageEnglish-
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC-
dc.subjectGHZ-
dc.titleA study on dielectric constants of epoxy/SrTiO3 composite for embedded capacitor films (ECFs)-
dc.typeArticle-
dc.identifier.wosid000248671200010-
dc.identifier.scopusid2-s2.0-34548185673-
dc.type.rimsART-
dc.citation.volume30-
dc.citation.issue3-
dc.citation.beginningpage428-
dc.citation.endingpage433-
dc.citation.publicationnameIEEE TRANSACTIONS ON ADVANCED PACKAGING-
dc.identifier.doi10.1109/TADVP.2007.898614-
dc.contributor.localauthorPaik, Kyung-Wook-
dc.contributor.nonIdAuthorLee, Sangyong-
dc.contributor.nonIdAuthorHyun, Jin-Gul-
dc.contributor.nonIdAuthorKim, Hyungsoo-
dc.type.journalArticleArticle-
dc.subject.keywordAuthorcomposite-
dc.subject.keywordAuthordielectric constant-
dc.subject.keywordAuthorembedded capacitor-
dc.subject.keywordAuthorepoxy resins-
dc.subject.keywordAuthorhigh frequency-
dc.subject.keywordPlusGHZ-
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