DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, YH | ko |
dc.contributor.author | Sung, TH | ko |
dc.contributor.author | Han, SC | ko |
dc.contributor.author | Han, YH | ko |
dc.contributor.author | Jeong, NH | ko |
dc.contributor.author | Kim, CJ | ko |
dc.contributor.author | Jun, BH | ko |
dc.contributor.author | Oh, SS | ko |
dc.contributor.author | Kim, HS | ko |
dc.contributor.author | Kim, TH | ko |
dc.contributor.author | No, Kwangsoo | ko |
dc.date.accessioned | 2013-03-07T04:01:58Z | - |
dc.date.available | 2013-03-07T04:01:58Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2007-10 | - |
dc.identifier.citation | PHYSICA C-SUPERCONDUCTIVITY AND ITS APPLICATIONS, v.463, pp.625 - 629 | - |
dc.identifier.issn | 0921-4534 | - |
dc.identifier.uri | http://hdl.handle.net/10203/89352 | - |
dc.description.abstract | A biaxially textured Cu(200) tape was used as a substrate for YBCO coated conductors by cold rolling followed by recrystallization. heat treatment. In this work, we studied the influence of annealing conditions and final tape thickness on the recrystallization process. Phi (phi) scan and omega (omega) scan XRD revealed that the best in-plane and out-of-plane alignment of the Cu tape (thickness 100 pm), measured in terms of full width half maximum (FWHM) values of 6.64 degrees and 4.49 degrees, were obtained by annealing at 800 degrees C for 30 min. The texture of CeO2 buffer layer thermally-evaporated on the Cu tape was also analyzed. (C) 2007 Elsevier B.V. All rights reserved. | - |
dc.language | English | - |
dc.publisher | ELSEVIER SCIENCE BV | - |
dc.subject | HIGH-TEMPERATURE SUPERCONDUCTORS | - |
dc.subject | BUFFER-LAYER | - |
dc.subject | NI TAPES | - |
dc.subject | FILMS | - |
dc.subject | DEPOSITION | - |
dc.subject | ALLOYS | - |
dc.title | Factors associated with biaxial texturing of Cu tapes for YBCO coated conductors | - |
dc.type | Article | - |
dc.identifier.wosid | 000250396000146 | - |
dc.identifier.scopusid | 2-s2.0-34548458600 | - |
dc.type.rims | ART | - |
dc.citation.volume | 463 | - |
dc.citation.beginningpage | 625 | - |
dc.citation.endingpage | 629 | - |
dc.citation.publicationname | PHYSICA C-SUPERCONDUCTIVITY AND ITS APPLICATIONS | - |
dc.contributor.localauthor | No, Kwangsoo | - |
dc.contributor.nonIdAuthor | Kim, YH | - |
dc.contributor.nonIdAuthor | Sung, TH | - |
dc.contributor.nonIdAuthor | Han, SC | - |
dc.contributor.nonIdAuthor | Han, YH | - |
dc.contributor.nonIdAuthor | Jeong, NH | - |
dc.contributor.nonIdAuthor | Kim, CJ | - |
dc.contributor.nonIdAuthor | Jun, BH | - |
dc.contributor.nonIdAuthor | Oh, SS | - |
dc.contributor.nonIdAuthor | Kim, HS | - |
dc.contributor.nonIdAuthor | Kim, TH | - |
dc.type.journalArticle | Article; Proceedings Paper | - |
dc.subject.keywordAuthor | YBCO | - |
dc.subject.keywordAuthor | cu tape | - |
dc.subject.keywordAuthor | RABiTS | - |
dc.subject.keywordAuthor | annealing condition | - |
dc.subject.keywordAuthor | tape thickness | - |
dc.subject.keywordPlus | HIGH-TEMPERATURE SUPERCONDUCTORS | - |
dc.subject.keywordPlus | BUFFER-LAYER | - |
dc.subject.keywordPlus | NI TAPES | - |
dc.subject.keywordPlus | FILMS | - |
dc.subject.keywordPlus | DEPOSITION | - |
dc.subject.keywordPlus | ALLOYS | - |
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