Simulation of capacitor discharge stud welding process and void formation

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Dynamic behaviour and void formation of the capacitor discharge ( CD) stud welding process are investigated through simulation and experiments. Mechanical and electrical models are coupled to predict the current and voltage waveform of the stud welding, and the calculated results show good agreement with the experiment results. The mechanism of void formation and the void trapping condition are explained using the void flow model. While the results of the void flow model show that removal of the void is almost impossible, partial improvement in void reduction is achieved by adjusting the short circuit current between 1200 and 1700 A.
Publisher
MANEY PUBLISHING
Issue Date
2007-05
Language
English
Article Type
Article
Citation

SCIENCE AND TECHNOLOGY OF WELDING AND JOINING, v.12, no.3, pp.274 - 281

ISSN
1362-1718
DOI
10.1179/174329307X166803
URI
http://hdl.handle.net/10203/88455
Appears in Collection
ME-Journal Papers(저널논문)
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