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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Journal Papers(저널논문)

Effects of Zn Addition on the Interface Microstructure and Drop Reliability of Sn-3.5Ag Solder on Cu pads

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dc.contributor.authorJee, Young-Kunko
dc.contributor.authorKo, Yong-Hoko
dc.contributor.authorSohn, Yoon-Chulko
dc.contributor.authorYu, Jinko
dc.date.accessioned2013-03-06T18:36:54Z-
dc.date.available2013-03-06T18:36:54Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2006-12-
dc.identifier.citationELECTRONIC MATERIALS LETTERS, v.2, no.3, pp.161 - 166-
dc.identifier.issn1738-8090-
dc.identifier.urihttp://hdl.handle.net/10203/87984-
dc.description.abstractVarying amounts of Zn(1, 3, and 7wt%) were added to Sn-3.5Ag solder on a Cu pad, and the effects of Zn on the interface microstructure and drop resistance were investigated. Results indicate that addition of 3wt% Zn increased the number of drops to failure (N-f) by about two times and that aging generally deteriorated the drop reliability. The beneficial role of Zn was ascribed to the suppression of Cu6Sn5 at the joint interface. Effects of aging were assumed to lead to the formation of double IMC layers (0Zn, 1Zn) and decomposition of Ag5Zn8 into brittle Ag3Sn and Cu6Sn5.-
dc.languageEnglish-
dc.publisherKorean Inst Metals Materials-
dc.titleEffects of Zn Addition on the Interface Microstructure and Drop Reliability of Sn-3.5Ag Solder on Cu pads-
dc.typeArticle-
dc.identifier.wosid000208605300002-
dc.type.rimsART-
dc.citation.volume2-
dc.citation.issue3-
dc.citation.beginningpage161-
dc.citation.endingpage166-
dc.citation.publicationnameELECTRONIC MATERIALS LETTERS-
dc.contributor.localauthorYu, Jin-
dc.contributor.nonIdAuthorJee, Young-Kun-
dc.contributor.nonIdAuthorKo, Yong-Ho-
dc.contributor.nonIdAuthorSohn, Yoon-Chul-
dc.description.isOpenAccessN-
dc.type.journalArticleArticle-
dc.subject.keywordAuthorlead-free solder-
dc.subject.keywordAuthorZn effect-
dc.subject.keywordAuthorintermetallic compound-
dc.subject.keywordAuthordrop test-
dc.subject.keywordPlusLEAD-FREE SOLDERS-
dc.subject.keywordPlusINTERMETALLIC COMPOUNDS-
dc.subject.keywordPlusMECHANICAL-PROPERTIES-
dc.subject.keywordPlusAG SOLDER-
dc.subject.keywordPlus(PB)-FREE-
dc.subject.keywordPlusGROWTH-
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MS-Journal Papers(저널논문)
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