Effects of Solder Alloys on Reliability of Low Cost Flip Chip Solder Joints using Electroless Ni-P UBMs
- Issue Date
- 2006-12
- Language
- English
- Citation
IEEE TRANSACTIONS ON ADVANCED PACKAGING
- ISSN
- 1521-3323
- Appears in Collection
- ME-Journal Papers(저널논문)
- Files in This Item
- There are no files associated with this item.
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