Effects of Solder Alloys on Reliability of Low Cost Flip Chip Solder Joints using Electroless Ni-P UBMs
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Jeon, Young Doo | ko |
| dc.contributor.author | Yang, Se Young | ko |
| dc.contributor.author | Paik, KW | ko |
| dc.contributor.author | Lee, Soon-Bok | ko |
| dc.date.accessioned | 2013-03-06T13:17:15Z | - |
| dc.date.available | 2013-03-06T13:17:15Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2006-12 | - |
| dc.identifier.citation | IEEE TRANSACTIONS ON ADVANCED PACKAGING | - |
| dc.identifier.issn | 1521-3323 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/87079 | - |
| dc.language | English | - |
| dc.publisher | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC | - |
| dc.title | Effects of Solder Alloys on Reliability of Low Cost Flip Chip Solder Joints using Electroless Ni-P UBMs | - |
| dc.type | Article | - |
| dc.type.rims | ART | - |
| dc.citation.publicationname | IEEE TRANSACTIONS ON ADVANCED PACKAGING | - |
| dc.contributor.localauthor | Lee, Soon-Bok | - |
| dc.contributor.nonIdAuthor | Jeon, Young Doo | - |
| dc.contributor.nonIdAuthor | Yang, Se Young | - |
| dc.contributor.nonIdAuthor | Paik, KW | - |
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