3-D construction of monolithic passive components for RF and microwave ICs using thick-metal surface micromachining technology

Abstract

As a viable technological option to address today's strong demands for high-performance monolithic low-cost passive components in RF and microwave integrated circuits (ICs), a new CMOS-compatible versatile thick-metal surface micromachining technology has been developed. This technology enables to build arbitrary three-dimensional (3-D) metal microstructures on standard silicon substrate as post-IC processes at low temperature below 120 degreesC. Using this technology, various highly suspended 3-D microstructures have been successfully demonstrated for RF and microwave IC applications. We have demonstrated spiral inductors suspended 100 mum over the substrate, coplanar waveguides suspended 50 mum over the substrate, and complicated microcoaxial lines, which have 50-mum-suspended center signal lines surrounded by inclined ground shields of 100 mum in height. The microwave performance of the microcoaxial transmission line fabricated on a glass substrate has been evaluated to achieve very low attenuation of 0.03 dB/mm. at 10 GHz with an effective dielectric constant of 1.6. The process variation/manufacturability, mechanical stability, and package issues also have been discussed in detail.