플립칩 솔더링의 자기정렬 효과에 관한 모델링Modeling of Self-Aligning Effect in Flip Chip Soldering
- Publisher
- 대한용접접합학회
- Issue Date
- 2002-12
- Language
- Korean
- Citation
대한용접접합학회지, v.20, no.6, pp.65 - 71
- ISSN
- 1225-6153
- Appears in Collection
- ME-Journal Papers(저널논문)
- Files in This Item
- There are no files associated with this item.
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