플립칩 솔더링의 자기정렬 효과에 관한 모델링Modeling of Self-Aligning Effect in Flip Chip Soldering
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 유중돈 | ko |
| dc.date.accessioned | 2013-03-04T11:56:46Z | - |
| dc.date.available | 2013-03-04T11:56:46Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2002-12 | - |
| dc.identifier.citation | 대한용접접합학회지, v.20, no.6, pp.65 - 71 | - |
| dc.identifier.issn | 1225-6153 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/82559 | - |
| dc.language | Korean | - |
| dc.publisher | 대한용접접합학회 | - |
| dc.title | 플립칩 솔더링의 자기정렬 효과에 관한 모델링 | - |
| dc.title.alternative | Modeling of Self-Aligning Effect in Flip Chip Soldering | - |
| dc.type | Article | - |
| dc.type.rims | ART | - |
| dc.citation.volume | 20 | - |
| dc.citation.issue | 6 | - |
| dc.citation.beginningpage | 65 | - |
| dc.citation.endingpage | 71 | - |
| dc.citation.publicationname | 대한용접접합학회지 | - |
| dc.contributor.localauthor | 유중돈 | - |
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- ME-Journal Papers(저널논문)
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