Current Status and Forecast on Development of Metal Matrix Composites for Electronic Packaging Applications전자패키징용 금속복합재료의 개발현황 및 전망
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Hong, Soon-Hyung | ko |
| dc.contributor.author | 이효수 | ko |
| dc.date.accessioned | 2013-03-04T02:07:35Z | - |
| dc.date.available | 2013-03-04T02:07:35Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2001-12 | - |
| dc.identifier.citation | 재료마당, v.14, no.8, pp.18 - 27 | - |
| dc.identifier.issn | 1738-7507 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/81428 | - |
| dc.language | Korean | - |
| dc.publisher | 대한금속재료학회 | - |
| dc.title | Current Status and Forecast on Development of Metal Matrix Composites for Electronic Packaging Applications | - |
| dc.title.alternative | 전자패키징용 금속복합재료의 개발현황 및 전망 | - |
| dc.type | Article | - |
| dc.type.rims | ART | - |
| dc.citation.volume | 14 | - |
| dc.citation.issue | 8 | - |
| dc.citation.beginningpage | 18 | - |
| dc.citation.endingpage | 27 | - |
| dc.citation.publicationname | 재료마당 | - |
| dc.contributor.localauthor | Hong, Soon-Hyung | - |
| dc.contributor.nonIdAuthor | 이효수 | - |
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