레이저 간섭계(ESPI)를 이용한 플립칩 패키지의 열변형 평가Evaluation of Thermal Deformations in Flip-Chip Package Using Electronic Speckle Pattern Interferometry
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Paik, Kyung-Wook | ko |
| dc.contributor.author | Jang, Woo-Soon | ko |
| dc.contributor.author | Lee, Baik-Woo | ko |
| dc.contributor.author | Kim, Dong-Won | ko |
| dc.contributor.author | Jeong, Jeung-Hyun | ko |
| dc.contributor.author | Kwon, Dong-Il | ko |
| dc.contributor.author | Nah, Jae-Woong | ko |
| dc.date.accessioned | 2013-03-04T02:07:15Z | - |
| dc.date.available | 2013-03-04T02:07:15Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2002-09 | - |
| dc.identifier.citation | 대한금속∙재료학회지, v.40, no.9, pp.995 - 1000 | - |
| dc.identifier.issn | 1738-8228 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/81426 | - |
| dc.language | Korean | - |
| dc.publisher | 대한금속∙재료학회지 | - |
| dc.title | 레이저 간섭계(ESPI)를 이용한 플립칩 패키지의 열변형 평가 | - |
| dc.title.alternative | Evaluation of Thermal Deformations in Flip-Chip Package Using Electronic Speckle Pattern Interferometry | - |
| dc.type | Article | - |
| dc.type.rims | ART | - |
| dc.citation.volume | 40 | - |
| dc.citation.issue | 9 | - |
| dc.citation.beginningpage | 995 | - |
| dc.citation.endingpage | 1000 | - |
| dc.citation.publicationname | 대한금속∙재료학회지 | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
| dc.contributor.nonIdAuthor | Jang, Woo-Soon | - |
| dc.contributor.nonIdAuthor | Lee, Baik-Woo | - |
| dc.contributor.nonIdAuthor | Kim, Dong-Won | - |
| dc.contributor.nonIdAuthor | Jeong, Jeung-Hyun | - |
| dc.contributor.nonIdAuthor | Kwon, Dong-Il | - |
| dc.contributor.nonIdAuthor | Nah, Jae-Woong | - |
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