레이저 간섭계(ESPI)를 이용한 플립칩 패키지의 열변형 평가Evaluation of Thermal Deformations in Flip-Chip Package Using Electronic Speckle Pattern Interferometry

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dc.contributor.authorPaik, Kyung-Wookko
dc.contributor.authorJang, Woo-Soonko
dc.contributor.authorLee, Baik-Wooko
dc.contributor.authorKim, Dong-Wonko
dc.contributor.authorJeong, Jeung-Hyunko
dc.contributor.authorKwon, Dong-Ilko
dc.contributor.authorNah, Jae-Woongko
dc.date.accessioned2013-03-04T02:07:15Z-
dc.date.available2013-03-04T02:07:15Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2002-09-
dc.identifier.citation대한금속∙재료학회지, v.40, no.9, pp.995 - 1000-
dc.identifier.issn1738-8228-
dc.identifier.urihttp://hdl.handle.net/10203/81426-
dc.languageKorean-
dc.publisher대한금속∙재료학회지-
dc.title레이저 간섭계(ESPI)를 이용한 플립칩 패키지의 열변형 평가-
dc.title.alternativeEvaluation of Thermal Deformations in Flip-Chip Package Using Electronic Speckle Pattern Interferometry-
dc.typeArticle-
dc.type.rimsART-
dc.citation.volume40-
dc.citation.issue9-
dc.citation.beginningpage995-
dc.citation.endingpage1000-
dc.citation.publicationname대한금속∙재료학회지-
dc.contributor.localauthorPaik, Kyung-Wook-
dc.contributor.nonIdAuthorJang, Woo-Soon-
dc.contributor.nonIdAuthorLee, Baik-Woo-
dc.contributor.nonIdAuthorKim, Dong-Won-
dc.contributor.nonIdAuthorJeong, Jeung-Hyun-
dc.contributor.nonIdAuthorKwon, Dong-Il-
dc.contributor.nonIdAuthorNah, Jae-Woong-
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