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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Journal Papers(저널논문)

Studies of electroless nickel under bump metallurgy-solder interfacial reactions and their effects on flip chip solder joint reliability

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dc.contributor.authorJeon, YDko
dc.contributor.authorPaik, Kyung-Wookko
dc.contributor.authorBok, KSko
dc.contributor.authorChoi, WSko
dc.contributor.authorCho, CLko
dc.date.accessioned2013-03-03T23:38:18Z-
dc.date.available2013-03-03T23:38:18Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2002-05-
dc.identifier.citationJOURNAL OF ELECTRONIC MATERIALS, v.31, no.5, pp.520 - 528-
dc.identifier.issn0361-5235-
dc.identifier.urihttp://hdl.handle.net/10203/80944-
dc.description.abstractA study on the electroless-deposited Ni-P under bump metallurgy (UBM) was performed for the fabrication of flip chip bumps. The interfacial reaction at the electroless Ni UBM/solder interface was investigated. The growth kinetics of the Ni-Sn intermetallic compounds (IMC) showed a rapid initial growth, followed by a reduced growth and a diffusion-controlled growth. Shear testing showed that the Ni UBM-Sn containing solder systems caused brittle bump failure, resulting in decreased bump adhesion strength.-
dc.languageEnglish-
dc.publisherInstitute of Electrical and Electronics Engineers-
dc.subjectNI-P-
dc.subjectKINETICS-
dc.titleStudies of electroless nickel under bump metallurgy-solder interfacial reactions and their effects on flip chip solder joint reliability-
dc.typeArticle-
dc.identifier.wosid000175804600033-
dc.identifier.scopusid2-s2.0-0036575898-
dc.type.rimsART-
dc.citation.volume31-
dc.citation.issue5-
dc.citation.beginningpage520-
dc.citation.endingpage528-
dc.citation.publicationnameJOURNAL OF ELECTRONIC MATERIALS-
dc.identifier.doi10.1007/s11664-002-0109-4-
dc.contributor.localauthorPaik, Kyung-Wook-
dc.contributor.nonIdAuthorJeon, YD-
dc.contributor.nonIdAuthorBok, KS-
dc.contributor.nonIdAuthorChoi, WS-
dc.contributor.nonIdAuthorCho, CL-
dc.type.journalArticleArticle; Proceedings Paper-
dc.subject.keywordAuthorUBM-
dc.subject.keywordAuthorelectroless Ni-
dc.subject.keywordAuthorsolder interfacial reaction-
dc.subject.keywordAuthorflip chip-
dc.subject.keywordPlusNI-P-
dc.subject.keywordPlusKINETICS-
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MS-Journal Papers(저널논문)
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