전자 재료 패키징에서의 금속/폴리머 접착력Metal/Polymer Adhesion in Electronic Packaging
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 유진 | ko |
| dc.date.accessioned | 2013-03-03T21:53:55Z | - |
| dc.date.available | 2013-03-03T21:53:55Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2002-05 | - |
| dc.identifier.citation | 대한금속·재료학회지, v.40, no.5, pp.518 - 527 | - |
| dc.identifier.issn | 1738-8228 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/80602 | - |
| dc.language | Korean | - |
| dc.publisher | 대한금속·재료학회 | - |
| dc.title | 전자 재료 패키징에서의 금속/폴리머 접착력 | - |
| dc.title.alternative | Metal/Polymer Adhesion in Electronic Packaging | - |
| dc.type | Article | - |
| dc.type.rims | ART | - |
| dc.citation.volume | 40 | - |
| dc.citation.issue | 5 | - |
| dc.citation.beginningpage | 518 | - |
| dc.citation.endingpage | 527 | - |
| dc.citation.publicationname | 대한금속·재료학회지 | - |
| dc.identifier.kciid | ART000882429 | - |
| dc.contributor.localauthor | 유진 | - |
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